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Coupling kinetic dislocation model and Monte Carlo algorithm for recrystallized microstructure modeling of severely deformed copper
Kazeminezhad, M
Coupling kinetic dislocation model and Monte Carlo algorithm for recrystallized microstructure modeling of severely deformed copper
Kazeminezhad, M ; Sharif University of Technology | 2008
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Viewed
- Type of Document: Article
- DOI: 10.1007/s10853-008-2953-y
- Publisher: 2008
- Abstract:
- By coupling a kinetic dislocation model and Monte Carlo algorithm, the recrystallized microstructure of severely deformed Oxygen Free High Conductivity Copper (OFHC) is predicted at different strains imposed by Equal-Channel- Angular-Pressing (ECAP) and annealing temperatures. From a flow field model, the strain rate distribution during the ECAP of the material in a curved die is calculated. Then using the kinetic dislocation model, the total dislocation density and correspondingly the stored energy after each ECAP pass is estimated. Utilizing the Monte Carlo algorithm and the stored energy, the recrystallized microstructure is predicted. The results show that the recrystallized grain size is decreased rapidly from the strain of first to fourth pass and then it is decreased slowly. Also, it is achieved that with increasing the annealing temperature, the grain size is increased. Moreover, a good agreement is observed between the predicted results and experimental data
- Keywords:
- Annealing ; Boolean functions ; Copper ; Equal channel angular pressing ; Forecasting ; Forming ; Grain size and shape ; Metal pressing ; Microstructure ; Monte Carlo methods ; Oxygen ; Pressing (forming) ; Recrystallization (metallurgy) ; Strain ; Strain rate ; Annealing temperature ; Annealing temperatures ; Deformed copper ; Dislocation densities ; Dislocation modeling ; Experimental data ; Flow field model ; Grain sizes ; Monte Carlo algorithms ; Oxygen-free high conductivity copper ; Rate distributions ; Recrystallized grains ; Recrystallized microstructures ; Stored energy ; Mathematical models
- Source: Journal of Materials Science ; Volume 43, Issue 18 , 1 September , 2008 , Pages 6081-6086 ; 00222461 (ISSN)
- URL: https://link.springer.com/article/10.1007/s10853-008-2953-y
