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  1. Combination of the upper bound and potts models for simulation of microstructure in wire drawing and annealing processes
Combination of the upper bound and potts models for simulation of microstructure in wire drawing and annealing processes
1060 viewed

Combination of the upper bound and potts models for simulation of microstructure in wire drawing and annealing processes

Kazeminezhad, M

Combination of the upper bound and potts models for simulation of microstructure in wire drawing and annealing processes

Kazeminezhad, M ; Sharif University of Technology | 2009

1060 Viewed
  1. Type of Document: Article
  2. DOI: 10.1007/s11665-008-9263-z
  3. Publisher: 2009
  4. Abstract:
  5. For microstructure modeling of copper wire after wire drawing process and annealing, an algorithm based on the Upper Bound Method and Potts Model is developed. In the algorithm, the Upper Bound Method is utilized to calculate the stored energy distribution in the drawn wire and then the stored energy is used in the Potts Model to obtain the grain size distribution of the drawn wire after annealing. The microstructure modeling is carried out at different deformation and annealing conditions. In all of the conditions, the fine and coarse grains are achieved at the surface and center of the wire, respectively. Also, the grain size of the drawn wire after annealing is decreased with increasing die angle and reduction in area. The modeling results are verified by the experimental results and a good agreement is achieved. © 2008 ASM International
  6. Keywords:
  7. Annealing conditions ; Annealing processes ; Coarse grains ; Copper wires ; Die angles ; Drawing processes ; Drawn wires ; Grain size distributions ; Grain sizes ; Modeling results ; Potts models ; Reduction in areas ; Simulation ; Stored energies ; Stored energy distributions ; Upper bounds ; Annealing ; Copper ; Grain size and shape ; Microstructure ; Simulated annealing ; Wire ; Wire drawing
  8. Source: Journal of Materials Engineering and Performance ; Volume 18, Issue 1 , 2009 , Pages 26-31 ; 10599495 (ISSN)
  9. URL: https://link.springer.com/article/10.1007%2Fs11665-008-9263-z