Sharif Digital Repository

Soldering is one of the important methods in joining techniques which has wide applications in industries such as microelectronic. Today, the physical and mechanical properties of solder joints is very important because the dimensions of electronic devices are decreasing that cause to increasing of their current density. One of the important problems of high current density in solder joints is the microstructures of solders in microelectronic components, change over time that is weakened the properties of the solder alloy. This study presents a quantitative model , which is capable to simulation phase separation and coarsening phenomenon in Tin/Lead Solders. This model is based on continuum... 

This study aims to investigate the creep deformation mechanisms in nickel-based single-crystal superalloys for which two-dimensional molecular dynamics (MD) simulations are conducted to model various temperature, stress conditions and phase interface crystal orientations. Ni-based single-crystal superalloys are of great importance in the aircraft industry, on account of their excellent high temperature creep resistance. This characteristic mainly originates from two features considered in their structure: first, their two-phased microstructure comprising gamma ( ) and gamma prime ( ), and the nature of this superalloy itself which is single-crystal. MD is a powerful tool to gain insight into...