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mariooryad--soroosh
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Total 4 records
| # | Type | Title | Author | Publisher | Pub. Year | Subjects | Call Number |
|---|---|---|---|---|---|---|---|
| 1 | پایان نامه | بهبود کارایی روش های بهسازی گفتار مبتنی بر مدل مخفی مارکوف Improving the Performance of HMM-Based Speech Enhancement Techniques | ماری اوریاد، سروش Mariooryad, Soroosh | صنعتی شریف | 1389 | مدل مخفی مارکوف Hidden Markov Model / نویز ناهمبسته Uncoherent Noise / فیلترهای حداقل مربعات خطا Minimum Mean Square Error Filters / بهبود گفتار Speech Enhancement / حداقل مربعات خطا Least Squeres Error (LSE) |
19-40552
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| 2 | مقاله | An algebraic gain estimation method to improve the performance of HMM-based speech enhancement systems | Mariooryad, S. | 2010 |
Hidden Markov model.
Algebraic gain estimation. Gain estimation. Least square errors. Minimum mean square error. Minimum mean square errors. Block codes. Electrical engineering. Estimation. Hidden Markov models. Least squares approximations. Mean square error. Speech enhancement. Algebra. Least square error. |
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| 3 | مقاله | Predicting crack initiation of solder joints with varying sizes under bending | Mirmehdi, S. | Springer New York LLC, | 2019 |
Critical strain energy release rate.
Joint thickness. Joint width. Solder joint. Cantilever beams. Crack initiation. Crack propagation. Energy release rate. Fracture. Fracture testing. Strain energy. Strain rate. Bond line thickness. Constraint. Crack tip plastic zone. Critical strain energy release rates. Double cantilever beam. Single set of parameters. Solder joints. Triaxiality factors. Crack tips. |
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| 4 | مقاله | Predicting crack initiation of solder joints with varying sizes under bending | Mirmehdi, S. | Springer New York LLC, | 2019 |
Constraint.
Critical strain energy release rate. Joint thickness. Joint width. Solder joint. Cantilever beams. Crack initiation. Crack propagation. Energy release rate. Fracture. Fracture testing. Strain energy. Strain rate. Bond line thickness. Crack tip plastic zone. Critical strain energy release rates. Double cantilever beam. Single set of parameters. Solder joints. Triaxiality factors. Crack tips. |
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